Thin-wall moulding with thermoplastic shielding compounds

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  • Shielding necessary to prevent electromagnetic environmental pollution
  • Better shielding performance eliminates need for secondary operations
  • Rheology optimized for easy processing and thin walls

As devices become increasingly smaller and electromagnetic pollution more serious with the increased use of electronic devices, the need for shielding materials is also increasing. To address this issue, Lehvoss America has introduced Luvocom ES, a new series of thermoplastic shielding compounds. The compounds have been developed for easy processing and can be used for the housings of electric and electronic devices such as computers, radios, phones, and laboratory equipment.

Shielding necessary to prevent electromagnetic environmental pollution

Shielding is necessary to prevent electromagnetic environmental pollution and hence an influence on sensitive electronic devices. A shielding effect is achieved by making the housings of the electronic components electrically conducting. This is usually done through the use of metal sheets and films, conductive coatings, and conductive compounds.

But such shielding materials are not very effective, causing customers to design with thicker walls or use additional metal coatings or steel sheets to protect against the electromagnetic waves. This means extra work for installation and extra costs.

Better shielding performance eliminates need for secondary operations

Compared to these compound products, Luvocom ES offers better shielding performance: it eliminates the need for secondary operations/installation of metal sheets or films or coatings, thus offering potential for a reduction in system costs. Furthermore parts can be smaller (no inlays/space for inlays) and more environmentally friendly due to less material mix and weight savings.

Rheology optimized for easy processing and thin walls

The compounds are ready to use, i.e. no adding of masterbatches before or at the hopper of the injection molding machine is necessary. This results in a much lower risk of defects in molded parts due to uneven distributed fillers in comparison to polymers and masterbatches that have been dry blended at the injection molding machine.

Due to its inherently high electrical conductivity, Luvocom ES allows small contact areas for necessary electric grounding. Overall shrinkage, flow and mechanical properties for some Luvocom ES compounds are close to standard PC/ABS with 20% glass fibers. Flame retardant materials are also available.

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