- Instant green strength after application
- Very thin bonding lines <0.5 mm possible
- Incorporated ultraviolet markers for automated inspection of finished parts
Dow Corning introduced a new hot melt room-temperature vulcanization (RTV) black adhesive for the assembly of smart devices and consumer electronics. The EA-4600 hot melt adhesive is formulated to dispense easily and achieve instant green strength, which allows electronic assemblies to be handled immediately after its application.
Very thin bonding lines <0.5 mm possible
EA-4600 Hot Melt Adhesive is a reactive material that can be applied as a liquid melt in very thin, <0.5-mm-wide, bonding lines. It cools quickly and cures at room temperature to become a viscoelastic polymer that provides strong, flexible, primerless adhesion to common plastic and metal substrates. The material offers service temperatures from -40°C to 150°C. It will soften when exposed to high temperatures, but revert to its typical properties after cooling.
Incorporated ultraviolet markers for automated inspection of finished parts
Unlike conventional polyurethane-based hot melt solutions, EA-4600 silicone hot melt adhesive incorporates ultraviolet (UV) markers to support automated UV inspection of finished parts. It can also be easily reworked within 24 hours of application. Once fully cured, the adhesive delivers very good, durable protection against chemicals, water and dust.
Material for smart devices that require narrow bezels
When designing and assembling smart devices that require narrow bezels, the hot melt adhesive’s narrow bead width, fast green strength and strong post-cure bond all offer expand options, compared to double-sided tape and conventional thermal cure adhesives. It can also enable a 5x improvement in the total cost of ownership vs. double-sided tape, based on 100 million smart phone window bonding operations that incorporate 0.8 mm bezels. EA-4600 Hot Melt Adhesive is a solventless, one-component, moisture-cure silicone material that offers longer open time and pot life, as well as lower odor and lower levels of volatility compared to conventional organic-based hot melt adhesives.